Patent · US Expired

Fabrication method for organic semiconductor transistor having organic polymeric gate insulating layer

US7071123B2 · kind B2 · utility

1Cited by
0References
12Claims
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Inventors

Key dates

Filing dateAug 24, 2001
Grant dateJul 4, 2006
Priority date
Expiry dateNov 5, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10K85/615

Abstract

Provided is a method for fabricating an organic semiconductor transistor having an organic polymeric gate insulating layer. The method includes forming an organic gate insulating layer on a substrate by a vapor deposition method using organic monomer sources, and causing a polymerization reaction to occur in the organic gate insulating layer to complete an organic polymeric gate insulating layer. Since the vapor deposition method, which is a low-temperature dry-type technique, is employed, the organic polymeric gate insulating layer can be uniformly formed on a large-area substrate by a simplified in-situ process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.