Epoxy adhesives and bonded substrates
US7071263B2 · kind B2 · utility
28Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2003 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.