Semiconductor device
US7071719B2 · kind B2 · utility
1Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jan 13, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/3202
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least three circuit substrates laid one upon another. The device further includes first circuit elements mounted, respectively, on at least two of the three circuit substrates. It also includes a second circuit element mounted on one of the three circuit substrates and configured to change connection between the first circuit elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.