Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards
US7072167B2 · kind B2 · utility
13Cited by
13References
13Claims
0Family size
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Key dates
| Filing date | Jun 28, 2004 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A capacitor structure is fabricated by forming a pattern of first dielectrics over a foil, forming first electrodes over the first dielectrics, and co-firing the first dielectrics and the first electrodes. Co-firing of the dielectrics and the electrodes alleviates cracking caused by differences in thermal coefficient of expansion (TCE) between the electrodes and the dielectrics. Co-firing also ensures a strong bond between the dielectrics and the electrodes. In addition, co-firing allows multi-layer capacitor structures to be constructed, and allows the capacitor electrodes to be formed from copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.