Memory module
US7072201B2 · kind B2 · utility
21Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2004 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | May 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is for buffering signals for memory chips on at least two circuit boards in the memory module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.