Method for protecting surface of stamper/imprinter during manufacture thereof
US7074341B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a stamper/imprinter for use in patterning of a recording medium comprising the sequential steps of providing a substrate/workpiece comprising a topographical pattern formed in a portion of a surface of the substrate/workpiece. The pattern defines a periphery. An alignment mark is formed in another portion of the surface of surrounding the periphery. An opaque protective film is formed overlying the entirety of the surface. A peripheral portion of the protective film is removed to expose the alignment mark. Selected portions of the substrate/workpiece are removed while the alignment mark is utilized for accurate alignment during the removal process. Remaining portions of the protective film are removed prior to use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.