Method for adhering large seasoning bits to a food substrate
US7074445B2 · kind B2 · utility
6Cited by
32References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Feb 28, 2024 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA23P20/12
- WIPO fieldFood chemistry
- WIPO sectorChemistry
Abstract
A method for adhering large three-dimensional seasoning bits to a snack food base whereby the bits are substantially adhered to the food substrate, or chip. A topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.