Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
US7074481B2 · kind B2 · utility
6Cited by
13References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2001 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Sep 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2835
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.