Polyimides used as microelectronic coatings
US7074493B1 · kind B1 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
New polynuclear aromatic diamines, such as 2,2′-di-(p-aminophenoxy)-biphenyl, a process for their manufacture and their use as polycondensation components for the manufacture of polyamide, polyamide-imide and polyimide polymers are described. The polymers obtained with the aromatic diamines according to the invention are readily soluble and can also be processed from the melt and are distinguished by good thermal, electrical and/or mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.