Light emitting device methods
US7074631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Apr 1, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/956
Abstract
A method includes disposing a planarization layer on a surface of a layer of semiconductor material and disposing a lithography layer on a surface of the planarization layer. The method also includes performing nanolithography to remove at least a portion of the planarization layer, at least a portion of the lithography layer and at least a portion of the layer of semiconductor material, thereby forming a dielectric function in the surface of the layer of semiconductor material that varies spatially according to a pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.