Method of fabricating a connection device
US7074707B2 · kind B2 · utility
4Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Feb 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connection device includes a plurality of re-configurable vias that connect a first metal layer to a second metal layer. An actuating element is disposed between the first metal layer and the second metal layer. The actuating element changes the configuration of the plurality of re-configurable vias to change the plurality of re-configurable vias between a conductive state and a non-conductive state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.