Curing accelerator, epoxy resin composition, and semiconductor device
US7074738B2 · kind B2 · utility
3Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Nov 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.