Circuit device and method for manufacturing the same
US7075188B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 24, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Feb 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to provide a circuit device 10 where a second circuit element 15B is exposed from a sealing resin 16, a circuit device 10A comprises: an island 12 to whose top a first circuit element 15A is fixedly fitted; a plurality of leads 11 which are extended around the island 12 and electrically connected to the first circuit element 15A; a sealing resin 16 which seals the first circuit element 15A, the island 12, and leads 11 and forms a cavity portion 18; and a second circuit element 15B stored in the cavity portion 18. Accordingly, since the second circuit element 15B can be externally provided, the degree of freedom for mounting can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.