Liquid-cooled inductive devices with interspersed winding layers and directed coolant flow
US7075399B2 · kind B2 · utility
31Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Sep 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F27/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-power, liquid-cooled, multi-layer winding inductive device that has a region of interspersed winding layers and directed coolant flow over the interspersed windings to improve heat transfer and device life.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.