System for damage location using a single channel continuous acoustic emission sensor
US7075424B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Aug 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor array for non-destructively monitoring a structure to detect a critical structural event. The sensor array includes a plurality of discrete sensor nodes, each of the discrete sensor nodes producing an electrical signal in response to a structural event. A signal adder is electrically connected to the plurality of discrete sensor nodes for receiving and combining the electrical signal from each of the discrete sensor nodes to form a single sensor array output signal. A signal processing module then receives and processes the single sensor output signal. In the preferred embodiment, the signal processing module uses the time interval between the electrical signals from each of the discrete sensor nodes formed into a single sensor array output signal to calculate the location of the critical structural event. Also, in the preferred embodiment, a data collection system is located downstream of the sensor processing module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.