Methods and apparatus for cut-and-paste editing of multiresolution surfaces
US7076117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2002 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Jul 27, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/2021
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In this invention there are described a set of algorithms based on multiresolution subdivision surfaces that perform at interactive rates and enable intuitive surface cut-and-paste operations. The method includes separating a source region of interest of a source surface into a source base surface and a source detail surface; separating a target region of interest of a target surface into a target base surface and a target detail surface; and pasting the source detail surface onto the target base surface in accordance with a mapping. The step of pasting includes parameterizing and mapping the parameterized regions of interest of the source and target surfaces into an intermediate plane, and aligning the parameterizations using a linear transformation that compensates for first order distortions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.