Optoelectronic package having a transmission line between electrical components and optical components
US7076123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2002 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Dec 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a “riser” that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a “submount” upon which electrical/optical/electro-optic components can be integrated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.