Pressurizing method
US7076867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2002 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Nov 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1084
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.