Method of potting a component
US7077174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2002 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Dec 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to a method of potting a component, namely encasing a component (110) in a potting compound (112) with, optionally, all or some of the voids in the component also being filled with potting compound. In particular, the present invention relates to potting a component that will be subject to high electric field strengths in use. The method comprises introducing an inert gas into a first pressure vessel (100) containing the component to be potted thereby to create an inert environment, introducing a potting compound into the first pressure vessel and allowing the potting compound to cure in the inert environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.