Liquid cooled thermosiphon with flexible coolant tubes
US7077189B1 · kind B1 · utility
41Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2005 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Jan 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-vapor transformation. The tubes are radially flexible to vary the volume of the tubes for modulating the flow of coolant liquid through the tubes in response to heat transferred by an electronic device to the lower portion of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.