Patent · US Expired

Modular low friction spindle assembly

US7077258B2 · kind B2 · utility

1Cited by
10References
32Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 23, 2004
Grant dateJul 18, 2006
Priority date
Expiry dateAug 27, 2024

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65G2207/38
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

Spindle assemblies include an upper spindle shaft with an undercut section, which reduces wear on parts. Assemblies include a depth stop on a probe pin to ensure accurate alignment upon reassembly with minimal time and effort.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.