Devices and methods for mounting circuit elements
US7077692B2 · kind B2 · utility
7Cited by
11References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2004 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Oct 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/948
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The described embodiments provide devices and methods for creating an electrical connection in an electronic system. The devices and methods include a standoff that connects a circuit element with a circuit board and supports the circuit element at a sufficient height above the circuit board to create an additional layout area. The additional layout area may be utilized to mount additional circuit elements to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.