Apparatus for fabricating a semiconductor device
US7077913B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 16, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/832
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shaped holder having brims and recessed portions, the brims for mounting the to-be-processed wafers thereon, thereby performing the required heat treatment. A tweezer plate of a wafer loading-transferring device is inserted onto the recessed portion or taken out therefrom, and the inserted tweezer plate is ascended or descended, so that the wafer can be inserted on the brims or taken out therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.