Method for producing an electrical circuit
US7078304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2005 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Apr 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/055
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to the conductive layers, and affixing the substrates together with the conductive layers between the substrates. These are either separate substrates or a unitary substrate. The IC is mounted either to a substrate, a conductive layer, or a dielectric layer. The IC is coupled to the conductive layers either directly or through openings formed in the dielectric layer. An interior conductive layer may be used to couple the IC to the conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.