Substrate-embedded capacitor, production method thereof, and circuit board
US7078311B2 · kind B2 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Dec 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/694
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a capacitor embedded in a substrate having a small thickness and requiring only a small space for short connection lines. The substrate-embedded capacitor comprises a substrate having an opening, a first conductive layer on the substrate, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and an insulating layer formed on the second conductive layer and having an opening. In the substrate-embedded capacitor, the first conductive layer and the second conductive layer are exposed through the openings in the substrate and the insulating layer, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.