Method of tissue repair II
US7078378B1 · kind B1 · utility
24Cited by
4References
91Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1999 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Jun 18, 2019 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2220/0058
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A substantially solid biomolecular solder for joining tissue comprising a partially denatured biomolecule. The solder can be formed into shapes to suit the needs of a user. The invention also relates to methods for joining tissue and methods for preparing the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.