Integrated circuit heat dissipation system
US7078803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2002 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.