Staggered torsional electrostatic combdrive and method of forming same
US7079299B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | May 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A staggered torsional electrostatic combdrive includes a stationary combteeth assembly and a moving combteeth assembly with a mirror and a torsional hinge. The moving combteeth assembly is positioned entirely above the stationary combteeth assembly by a predetermined vertical displacement during a combdrive state. A method of fabricating the staggered torsional electrostatic combdrive includes the step of deep trench etching a stationary combteeth assembly in a first wafer. A second wafer is bonded to the first wafer to form a sandwich including the first wafer, an oxide layer, and the second wafer. A moving combteeth assembly is formed in the second wafer. The moving combteeth assembly includes a mirror and a torsional hinge. The moving combteeth assembly is separated from the first wafer by the oxide layer. The oxide layer is subsequently removed to release the staggered torsional electrostatic combdrive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.