System and method for heat dissipation and air flow redirection in a chassis
US7079390B2 · kind B2 · utility
10Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Jan 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The apparatus further comprises a fin thermally coupled to the heat sink base for dissipating the thermal heat. The fin is arranged in the chassis to direct air flow from a first direction, that is originally directed at said fin, to a second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.