Printed circuit boards having improved solder pads
US7079399B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2004 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1446
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.