Flip-chip automatically aligned optical device
US7079559B2 · kind B2 · utility
1Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/227
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the first contact area of the P layer and the second contact layer of the N layer reside on the first side of the laser device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.