Apparatus and method for temperature control of integrated circuits
US7079972B1 · kind B1 · utility
19Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Dec 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment disclosed relates to an apparatus for temperature control of an integrated circuit on a circuit board. The apparatus includes a first resistor on the circuit board, a second resistor on the circuit board, and a heat conductive material. The heat conductive material is attached to both the first and second resistors and to a surface of a package containing the integrated circuit. Another embodiment disclosed relates to an apparatus that provides both cooling and heating functionality in order to maintain the operational temperature of the IC within an acceptable range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.