Polymeric thermal history sensor
US7080939B1 · kind B1 · utility
8Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2004 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Feb 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K11/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved thermal history sensor having multiple polymeric substrates with unique compositions is disclosed. By positioning the sensor adjacent to an item subject to thermal stressors, each of the polymeric substrates react with a different rate of crystallization and thus yield a specific measure of infrared (IR) absorption spectra, for example. By comparing these measurements for each polymeric substrate, a thermal history fingerprint may be obtained. This thermal history fingerprint may then be compared to baseline data to yield information about the item, such as the expected remaining useful lifetime of the item.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.