Combined coating process comprising magnetic field-assisted, high power, pulsed cathode sputtering and an unbalanced magnetron
US7081186B2 · kind B2 · utility
23Cited by
3References
22Claims
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Key dates
| Filing date | Nov 20, 2003 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | May 28, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A PVD process for coating substrates, wherein the substrate is pre-treated in the vapor of a pulsed, magnetic field-assisted cathode sputtering operation, and during pre-treatment a magnetic field arrangement of the magnetron cathode type, with a strength of the horizontal component in front of the target of 100 to 1500 Gauss, is used for magnetic field-assistance, and after pre-treatment further coating is effected by means of cathode sputtering and the power density of the pulsed discharge during pre-treatment is greater than 1000 W.cm−2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.