Peroxide curable compounds based on butyl-like polymer without conjugated aliphatic dienes in its composition
US7081502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2003 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a shaped article containing at least one peroxide curable compound containing a butyl-like polymer(s) without any conjugated aliphatic diene in its composition, said polymer containing less than 15 wt. % of solid matter insoluble in boiling cyclohexane under reflux for 60 min. The present invention also relates to a sealing material and a medical device containing at least one peroxide-curable compound containing a butyl-like polymer containing less than 15 wt. % of solid matter insoluble in boiling cyclohexane under reflux for 60 min. Further, the present invention relates to a process for producing a butyl-like polymer having no conjugated aliphatic diene in its composition and containing less than 15 wt. % of solid matter insoluble in boiling cyclohexane under reflux for 60 min. In addition, the present invention relates to a process the manufacturing of the inventive compound wherein the elastomeric polymer is mixed with at least one filler and at least one peroxide curing system in a mixing means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.