Interposer with signal and power supply through vias
US7081650B2 · kind B2 · utility
20Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Mar 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A planar thin film multi-layer capacitor having a high dielectric constant with a plurality of conductive through vias and a plurality of pairs of conductive through vias having a low dielectric constant and operating in a transverse electromagnetic wave mode for high frequency signals on the pairs of vias. Vias coupled to the capacitor are arranged to propagate alternate polarity. The interposer is adapted for coupling directly to a die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.