Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus
US7081659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Sep 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/957
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, electrically separated from each other. The inter-layer insulating layer is formed the lower conductive film strips. The implanted conductive members are implanted in connection holes formed in the inter-layer insulating layer at positions corresponding to both edge sides of the lower conductive film strips. The upper conductive film strips are formed on the implanted conductive members and the inter-layer insulating layer to connect the lower conductive film strips in series so that the lower conductive film strips, the implanted conductive members, and the upper conductive film strips form an electric coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.