Hermetic package with internal ground pads
US7081660B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2001 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical connections between signal wire bond areas within the hermetic boundary to electrical contact areas outside the hermetic boundary. Additionally, according to the invention, ground wire bond pad areas are also provided within the hermetic boundary, the ground wire bond pad areas being electrically connected to each other and/or the frame or other ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.