Circuit cooling
US7082034B2 · kind B2 · utility
15Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Jan 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing cover to cause electrical components to engage with at least one component pad of a heat sink, the cover including a projection integrally formed from the housing cover and positioned on the cover for biasing the electrical component against the component pad, and a mechanism that permits a vertical displacement of the projection relative to the vertical displacement of the housing cover. In one example, a slot extends around at least part of the projection so as to substantially decouple a vertical displacement of the projection from a vertical displacement of the housing cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.