Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
US7082679B2 · kind B2 · utility
8Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.