Intermetallic spring structure
US7082684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A spring structure in which the transition of a metal layer from a solid solution to an intermetallic compound is utilized either to bend a spring finger into a curved shape, or to increase the yield point of the spring finger. The spring finger has an anchor portion attached to a substrate, and a cantilever portion extending over the substrate surface. The metal layer forms at least a portion of the spring finger. The metal layer is initially formed as a solid solution including a primary and secondary elements that transform to an intermetallic compound upon annealing, thereby generating a bending force that causes the cantilever portion of the spring finger to bend relative to the substrate, and/or to increase the yield point of the bent cantilever portion. The metal layer is formed by plating and/or sputtering, and annealing is performed before and/or after release of the cantilever portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.