Pressure sensor apparatus and method
US7082835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2003 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0075
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.