Method for transferring a pattern
US7082876B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2003 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and a device for forming at least a first pattern on a substrate (6,28), which is coated with a layer (5) on at least a first planar surface, are described. According to the method, a first pressing means (27) is arranged with a first structure (32) that defines the pattern, and the substrate (28) is arranged so that the first pressing means (27) is separated from the substrate (28) and so that the first pressing means (27) and the substrate (28) are unable to move transversely of the common center line (50) but are able to move freely in a direction along the center line (50). Subsequently, the first pressing means (27) is contacted with the substrate (28) while maintaining the common center line, and a pressure is applied to the substrate (28) and the first pressing means (27) to form said at least one pattern in the layer (30)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.