Slotted substrates and methods of making
US7083268B2 · kind B2 · utility
4Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2003 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Jul 13, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.