Method of making semiconductor bonding tools

US7083757B2 · kind B2 · utility

Inventors

• Romain Billiet · Tualatin, US
• Hanh Nguyen · Bukit Mertajam, MY

Key dates

• Filing date: Feb 18, 2002
• Grant date: Aug 1, 2006
• Expiry date: Feb 18, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Semiconductor wire bonding tools used in the assembly and interconnection of integrated circuits (ICs) are micromolded from a mixture of ultrafine particulate materials mixed with an organic binder. Following extraction of the binder the green bonding tools are sintered during which they undergo isotropic, constant and accurately predetermined shrinkage. Hence semiconductor wire bonding tools can be produced with virtually no limit to miniaturization, thus allowing the fabrication of higher integrated semiconductor products.