Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
US7083759B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Apr 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49993
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10−6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.