Integrated package design and method for a radiation sensing device
US7084010B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2003 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Mar 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50, 52) formed from a solder pre-form (58, 60) to define a vacuum chamber (56). Feedthroughs (18, 40, 44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector (10) aligns a lower detector assembly (62), the frame (48) the window (46), and the solder pre-forms (58, 60) in a non-sealed relation within a processing chamber (80, 94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads (88). The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58, 60). The method eliminates the need for a seal port, combines several steps within the processing chamber (80, 94), and eliminates certain prior art cleaning steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.