Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process
US7084098B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Jul 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed herein are a brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface, and a method for improving adhesion of a polyimide surface by applying the composition to a brown oxide process. The brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface comprises, 5˜15 g/L of an amine; 190˜210 g/L of a hydroxide compound; at least one additive selected from 3˜6 g/L of a cleaner adjuvant, 0.1˜5 g/L of a antifoaming agent and 1˜10 g/L of a precipitation inhibitor; and the balance of water. When the brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface is applied to a pretreatment step of a brown oxide process, it can clean a copper surface and improve adhesion of a polyimide surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.