Curable liquid resin composition
US7084187B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2002 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Sep 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D4/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film.A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by —X—C(═Y)—NH— (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.