Heat activated epoxy adhesive and use in a structural foam insert
US7084210B2 · kind B2 · utility
11Cited by
112References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2003 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | May 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small voids and unusually high Young's modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.